HS-320 Desktop Selective Soldering Machine
The HS-320 is a compact, desktop-style selective soldering system designed for high-precision through-hole component soldering. It is an excellent choice for small-batch production, prototyping, and maintenance environments where space is limited but quality cannot be compromised.
Product Specifications
| Specification Item |
HS-320 |
| Applicable PCB Board Size (L*W) |
50×50 ~ 320×250 mm |
| Applicable PCB Thickness |
Board thickness: 0.8~3mm / Pin length: within 3mm |
| Component Height |
Above board: below 100mm / Below board: below 50mm |
| PCB Shape & Conditions |
1. PCB handling edge: ≥3mm
2. Weight of components: below 3KG
3. Board warpage: below 0.5mm |
| Solder Pot Material / Capacity |
Stainless Steel / 10KG |
| Solder Pot Power |
3×500W / 1.5KW |
| N2 Requirements |
Purity: 99.999%
Pressure / Consumption: 0.5MPa / 20-30 L/min / 1.2-1.5 m³/H |
| Flux Nozzle |
Precision fluid nozzle |
| Flux Capacity |
2L (Manual filling) |
| Air Supply |
0.5-0.7 Mpa |
| Nozzle Inner Diameter |
Φ3mm ~ Φ20mm (customizable) |
| Wave Height |
Automatic adjustment / height measurement |
| System Control |
PC + PLC (Windows + Inovance) |
| Programming Software |
Supports image drawing for programming (fast and convenient) |
| Power Supply / Power |
Single phase 220V ±10%
Start-up power: 2KW |
| Weight |
70KG (including 10KG solder) |
| Overall Dimensions (L*W*H) |
730 × 800 × 840 mm |
Key Features
- True Desktop Design - With a footprint of just 730×800 mm, the HS-320 fits easily on any workbench -- ideal for labs, repair centers, and small workshops.
- Precision Selective Soldering - Supports programmable wave height and customizable nozzle diameters (Φ3-20 mm), allowing precise soldering of individual through-hole pins without affecting surrounding SMD components.
- Smart Control System - Combines a PC (Windows) and PLC (Inovance) for stable, real-time control. The image-based programming software lets operators create soldering paths quickly by drawing directly on a PCB image.
- N2 Ready - Built-in support for high-purity nitrogen (99.999%) improves wetting, reduces dross, and ensures consistent solder joint quality.
- Automatic Wave Height Calibration - The system automatically measures and adjusts wave height, reducing manual setup time and improving repeatability.
- Integrated Solder Pot - Stainless steel pot with 10 kg capacity and 1.5 kW heating power -- sufficient for continuous operation in low-to-medium volume production.
Preheating Systems
Top Side Preheating (Optional)
1KW infrared heating tube preheats the PCB board top before soldering, meeting high temperature requirements for special elements. Reduces thermal shock, activates flux activity, improves pin tin penetration, and enhances overall soldering quality.
Bottom Side Preheating
Utilizes fast infrared heat conduction to preheat PCB boards before soldering and maintains heating during the process. Features synchronized "preheating + soldering" design principle that improves efficiency, increases tin penetration rate, reduces thermal shock for heat-sensitive elements, and ensures high cleanliness of PCB after soldering.
Applications
- Through-hole component soldering
- PCB repair and rework
- Prototype verification
- Small-batch production
- R&D labs and technical training
Why Choose the HS-320?
The HS-320 bridges the gap between expensive inline selective soldering systems and manual soldering stations. It offers automation, precision, and repeatability at a fraction of the cost and space -- making it the smart choice for engineers and small-scale manufacturers.
